The modular Technology of MI300
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AMD’s MI300 combines five next-gen technologies into one 147 billion transistor chip monster. In this video we will take a closer look at the technologies AMD uses to combine CDNA3 GPU cores with Zen 4 CPU cores to create the worlds first HPC AI APU and talk about AMD’s strategy for reaching Zettascale in the future.
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0:00 Intro
0:42 Five next-gen technologies of MI300
3:19 MI300 Specs
4:36 Chiplet Design
8:06 Brilliant
9:15 Advanced Packaging / 3D Stacking
11:48 SoC / APU Design
13:15 Unified Memory
14:16 AI / ML Acceleration
15:15 AMD’s Zettascale Strategy
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